Vulnerability
CVE-2023-33063
Location: OS
Memory corruption in DSP Services during a remote call from HLOS to DSP.
Impact
Severity (Manufact.)
HIGH
Severity (NIST)
7.8
Severity (Android)
N/A
Chipsets
36
Devices
1373
Affected Hardware
Name | Also known as | Manufacturer |
---|---|---|
MSM8905 | Qualcomm 205 | Qualcomm |
QM215 | Qualcomm 215 | Qualcomm |
SM4250-AA | Snapdragon 460 | Qualcomm |
SM4350 | Snapdragon 480 | Qualcomm |
SM4350-AC | Snapdragon 480+ | Qualcomm |
SM4375 | Snapdragon 4 Gen 1 | Qualcomm |
SDM660 | Snapdragon 660 | Qualcomm |
SM6125 | Snapdragon 665 | Qualcomm |
SM6150 | Snapdragon 675 | Qualcomm |
SM6150-AC | Snapdragon 678 | Qualcomm |
36 of 36 row(s) shown.
Rows per page
Page 1 of 4
Information reliability
The information on this website is intended to provide information on the big picture of chipset security and measure trends within the industry. Our information is obtained from several vantage points, checked for consistency, and automatically cross-referenced. However, this process may not always yield reliable information. Do not use the information on a particular vulnerability, chipset or device to verify your individual exposure in cases where inaccuracies are inacceptable, for instance to assess risks if you are a Politically Exposed Person.
Timeline
Introduced (est):
Jan 1, 2017
Reported:
Dec 18, 2022
Advisory Published:
Dec 4, 2023
CVE Published:
Dec 5, 2023
Android Patch Level:
Dec 2023