Vulnerability
CVE-2023-33031
Component: AUDIO
Location: OS
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
Impact
Severity (Manufact.)
HIGH
Severity (NIST)
7.8
Severity (Android)
N/A
Chipsets
20
Devices
699
Affected Hardware
Name | Also known as | Manufacturer |
---|---|---|
MSM8905 | Qualcomm 205 | Qualcomm |
QM215 | Qualcomm 215 | Qualcomm |
SDM429 | Snapdragon 429 | Qualcomm |
SM4350 | Snapdragon 480 | Qualcomm |
SM4350-AC | Snapdragon 480+ | Qualcomm |
SDM660 | Snapdragon 660 | Qualcomm |
SM6225 | Snapdragon 680 | Qualcomm |
SM6225-AD | Snapdragon 685 | Qualcomm |
SM6350 | Snapdragon 690 | Qualcomm |
SM6375 | Snapdragon 695 | Qualcomm |
20 of 20 row(s) shown.
Rows per page
Page 1 of 2
Information reliability
The information on this website is intended to provide information on the big picture of chipset security and measure trends within the industry. Our information is obtained from several vantage points, checked for consistency, and automatically cross-referenced. However, this process may not always yield reliable information. Do not use the information on a particular vulnerability, chipset or device to verify your individual exposure in cases where inaccuracies are inacceptable, for instance to assess risks if you are a Politically Exposed Person.
Timeline
Introduced (est):
Jan 1, 2017
Reported:
Mar 21, 2023
Advisory Published:
Nov 6, 2023
CVE Published:
Nov 7, 2023
Android Patch Level:
Nov 2023