Vulnerability
CVE-2017-18157
Component: POWER
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Impact
Severity (Manufact.)
N/A
Severity (NIST)
7.8
Severity (Android)
N/A
Chipsets
14
Devices
501
Affected Hardware
| Name | Also known as | Manufacturer |
|---|---|---|
| MSM8909 | Snapdragon 210 | Qualcomm |
| MSM8909AA | Snapdragon 212 | Qualcomm |
| MSM8929 | Snapdragon 415 | Qualcomm |
| MSM8917 | Snapdragon 425 | Qualcomm |
| SDM450 | Snapdragon 450 | Qualcomm |
| MSM8939 | Snapdragon 615 | Qualcomm |
| MSM8953 | Snapdragon 625 | Qualcomm |
| MSM8956 | Snapdragon 650 | Qualcomm |
| MSM8996Lite | Snapdragon 820 | Qualcomm |
| MSM8996 | Snapdragon 820 | Qualcomm |
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Rows per page
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Information reliability
The information on this website is intended to provide information on the big picture of chipset security and measure trends within the industry. Our information is obtained from several vantage points, checked for consistency, and automatically cross-referenced. However, this process may not always yield reliable information. Do not use the information on a particular vulnerability, chipset or device to verify your individual exposure in cases where inaccuracies are inacceptable, for instance to assess risks if you are a Politically Exposed Person.
Timeline
Introduced (est):
Jan 1, 2014
Reported:
Unknown
Advisory Published:
Mar 25, 2019
CVE Published:
May 6, 2019
Android Patch Level:
Jun 2018
