Vulnerability
CVE-2023-33044
Component: CELLULAR
Location: FIRMWARE
Transient DOS in Data modem while handling TLB control messages from the Network.
Impact
Severity (Manufact.)
HIGH
Severity (NIST)
7.5
Severity (Android)
N/A
Chipsets
18
Devices
635
Affected Hardware
Name | Also known as | Manufacturer |
---|---|---|
SM4350 | Snapdragon 480 | Qualcomm |
SM4350-AC | Snapdragon 480+ | Qualcomm |
SM4375 | Snapdragon 4 Gen 1 | Qualcomm |
SM6350 | Snapdragon 690 | Qualcomm |
SM6375 | Snapdragon 695 | Qualcomm |
SM7225 | Snapdragon 750G | Qualcomm |
SM7250-AA | Snapdragon 765 | Qualcomm |
SM7250-AB | Snapdragon 765G | Qualcomm |
SM7250-AC | Snapdragon 768G | Qualcomm |
SM7325 | Snapdragon 778G | Qualcomm |
18 of 18 row(s) shown.
Rows per page
Page 1 of 2
Information reliability
The information on this website is intended to provide information on the big picture of chipset security and measure trends within the industry. Our information is obtained from several vantage points, checked for consistency, and automatically cross-referenced. However, this process may not always yield reliable information. Do not use the information on a particular vulnerability, chipset or device to verify your individual exposure in cases where inaccuracies are inacceptable, for instance to assess risks if you are a Politically Exposed Person.
Timeline
Introduced (est):
Jan 1, 2020
Reported:
Apr 20, 2023
Advisory Published:
Dec 4, 2023
CVE Published:
Dec 5, 2023
Android Patch Level:
Jan 2024