Vulnerability
CVE-2023-33029
Location: OS
Memory corruption in DSP Service during a remote call from HLOS to DSP.
Impact
Severity (Manufact.)
HIGH
Severity (NIST)
7.8
Severity (Android)
N/A
Chipsets
16
Devices
588
Affected Hardware
Name | Also known as | Manufacturer |
---|---|---|
SM4350 | Snapdragon 480 | Qualcomm |
SM4350-AC | Snapdragon 480+ | Qualcomm |
SM4375 | Snapdragon 4 Gen 1 | Qualcomm |
SM4450 | Snapdragon 4 Gen 2 | Qualcomm |
SM6225 | Snapdragon 680 | Qualcomm |
SM6225-AD | Snapdragon 685 | Qualcomm |
SM6375 | Snapdragon 695 | Qualcomm |
SM7325 | Snapdragon 778G | Qualcomm |
SM7325-AE | Snapdragon 778G+ | Qualcomm |
SM7350-AB | Snapdragon 780G | Qualcomm |
16 of 16 row(s) shown.
Rows per page
Page 1 of 2
Information reliability
The information on this website is intended to provide information on the big picture of chipset security and measure trends within the industry. Our information is obtained from several vantage points, checked for consistency, and automatically cross-referenced. However, this process may not always yield reliable information. Do not use the information on a particular vulnerability, chipset or device to verify your individual exposure in cases where inaccuracies are inacceptable, for instance to assess risks if you are a Politically Exposed Person.
Timeline
Introduced (est):
Jan 1, 2021
Reported:
Unknown
Advisory Published:
Oct 2, 2023
CVE Published:
Oct 3, 2023
Android Patch Level:
Oct 2023